Palm Pre Teardown Reveals Qualcomm Components

• The key wireless semiconductor in the Pre is a Qualcomm MSM6810A baseband processor, which supports its communications capabilities via CDMA2000 1X and CDMA2000 iX Rev A EV-DO.

• Qualcomm also supplies two radio frequency chips, the RFR6500 receiver and the RFT 6150 transmitter. All together, Qualcomm contributes $18.45 worth of semiconductor content to the Pre.

• The iSuppli team also found it notable that Palm chose a Maxim MAX8695 power management integrated circuit for power management, instead of Qualcomm’s PM6650 chip.

• Maxim MAX8695 power management integrated circuit is also used in LG Voyager mobile.